发明授权
- 专利标题： Stack package utilizing through vias and re-distribution lines
- 专利标题（中）： 堆叠包通过通孔和再分配线路
-
申请号： US11647703申请日： 2006-12-29
-
公开(公告)号： US07598617B2公开(公告)日： 2009-10-06
- 发明人: Seung Hyun Lee , Min Suk Suh
- 申请人： Seung Hyun Lee , Min Suk Suh
- 申请人地址： KR Kyoungki-do
- 专利权人： Hynix Semiconductor Inc.
- 当前专利权人： Hynix Semiconductor Inc.
- 当前专利权人地址： KR Kyoungki-do
- 代理机构： Ladas & Parry LLP
- 优先权： KR10-2006-0025054 20060317
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L23/48 ; H01L23/12 ; H01L25/065 ; H01L25/07 ; H01L25/18
摘要：
A stack package includes a printed circuit board; at least two semiconductor chips stacked on the printed circuit board, each having first re-distribution lines formed on the upper surface thereof and connected to bonding pads, through silicon vias which are formed therethrough and connected to the first re-distribution lines, and second re-distribution lines formed on the lower surface thereof and connected to the through silicon vias; first and second solder balls interposed between the first and second re-distribution lines which face each other and between the first re-distribution lines of the lowermost semiconductor chip and electrode terminals of the printed circuit board; a molding material for molding the upper surface of the printed circuit board including the stacked semiconductor chips; and third solder balls attached to ball lands formed on the lower surface of the printed circuit board.
公开/授权文献
信息查询
IPC分类:
