发明授权
- 专利标题: Prepreg and laminate
- 专利标题(中): 预浸料和层压板
-
申请号: US12068298申请日: 2008-02-05
-
公开(公告)号: US07601429B2公开(公告)日: 2009-10-13
- 发明人: Yoshihiro Kato , Masayoshi Ueno , Takeshi Nobukuni
- 申请人: Yoshihiro Kato , Masayoshi Ueno , Takeshi Nobukuni
- 申请人地址: JP Tokyo
- 专利权人: Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人: Mitsubishi Gas Chemical Company, Inc.
- 当前专利权人地址: JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2007-028117 20070207; JP2007-186929 20070718
- 主分类号: B32B15/09
- IPC分类号: B32B15/09 ; B32B27/18 ; B32B27/20 ; B32B27/36
摘要:
A prepreg, for printed wiring boards, comprising a flame resistant resin composition containing a specific cyanate ester resin, a nonhalogen epoxy resin, boehmite which is hardly soluble in acids or alkalis and a silicone powder which is a flame retardant assistant, and a base material, which prepreg retains high-degree flame resistance without a halogen compound and has excellent resistance to chemical, high glass transition temperature, excellent soldering heat resistance and excellent heat resistance after moisture absorption, and a laminate or metal-foil-clad laminate obtained by curing the above prepreg.
公开/授权文献
- US20080187763A1 Prepreg and laminate 公开/授权日:2008-08-07