Invention Grant
- Patent Title: High voltage semiconductor devices and methods for fabricating the same
- Patent Title (中): 高压半导体器件及其制造方法
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Application No.: US11692213Application Date: 2007-03-28
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Publication No.: US07602037B2Publication Date: 2009-10-13
- Inventor: Yi-Chun Lin , Chi-Chih Chen , Kuo-Ming Wu , Ruey-Hsin Liu
- Applicant: Yi-Chun Lin , Chi-Chih Chen , Kuo-Ming Wu , Ruey-Hsin Liu
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Thomas, Kayden, Horstemeyer & Risley
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06

Abstract:
An exemplary embodiment of a semiconductor device capable of high-voltage operation includes a substrate with a well region therein. A gate stack with a first side and a second side opposite thereto, overlies the well region. Within the well region, a doped body region includes a channel region extending under a portion of the gate stack and a drift region is adjacent to the channel region. A drain region is within the drift region and spaced apart by a distance from the first side thereof and a source region is within the doped body region near the second side thereof. There is no P-N junction between the doped body region and the well region.
Public/Granted literature
- US20080237703A1 HIGH VOLTAGE SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME Public/Granted day:2008-10-02
Information query
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