发明授权
- 专利标题： Semiconductor light-emitting device, semiconductor light-emitting module, and method of manufacturing the semiconductor light-emitting module
- 专利标题（中）： 半导体发光器件，半导体发光模块以及半导体发光模块的制造方法
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申请号： US11519144申请日： 2006-09-12
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公开(公告)号： US07605452B2公开(公告)日： 2009-10-20
- 发明人: Toshihiro Yamanaka , Hiroyuki Tsukamoto , Kiyoharu Kishimoto
- 申请人： Toshihiro Yamanaka , Hiroyuki Tsukamoto , Kiyoharu Kishimoto
- 申请人地址： JP Osaka
- 专利权人： Hitachi Maxell, Ltd.
- 当前专利权人： Hitachi Maxell, Ltd.
- 当前专利权人地址： JP Osaka
- 代理机构： Oliff & Berridge, PLC
- 优先权： JP2005-294886 20051007; JP2005-294905 20051007
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/12
摘要：
A semiconductor light-emitting device according to an embodiment of the present invention includes chip LEDs formed on a silicon submount, in which a wiring pattern having a chip connecting terminal portion connecting the chip LEDs, an external connecting terminal portion connecting an external unit, and a plurality of lead portions connecting a corresponding chip connecting terminal portion and a corresponding external connecting terminal portion is formed on the silicon submount, and an area of the chip connecting terminal portions is made larger than an area of a region where the chip connecting terminal portion overlaps with the chip LEDs. Accordingly, a semiconductor light-emitting device of high heat radiation property and heat resistance can be provided.
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