Invention Grant
- Patent Title: Contactless IC card system
- Patent Title (中): 非接触式IC卡系统
-
Application No.: US11688121Application Date: 2007-03-19
-
Publication No.: US07609109B2Publication Date: 2009-10-27
- Inventor: Shigeru Arisawa
- Applicant: Shigeru Arisawa
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP10-162274 19980610
- Main IPC: H03D1/10
- IPC: H03D1/10 ; H03K9/00 ; H03K9/02

Abstract:
In a contactless IC card system, a modulating circuit manufactured in an IC form is operable at a high power efficiency. The demodulating apparatus is configured to include: signal processing means for producing first and second input signals; first clamping circuit for clamping said first input signal; second clamping circuit for clamping said second input signal; first band limiting means for removing a component of said first input signal from an output signal of said first clamping circuit; second band limiting means for removing a component of said second input signal from an output signal of said second clamping circuit; and calculating means for adding, or averaging an output signal of said first band limiting means and an output signal of said second band limiting means.
Public/Granted literature
- US20070170985A1 CONTACTLESS IC CARD SYSTEM Public/Granted day:2007-07-26
Information query
IPC分类: