Invention Grant
- Patent Title: Heat-dissipating model
- Patent Title (中): 散热模型
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Application No.: US11459453Application Date: 2006-07-24
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Publication No.: US07610947B2Publication Date: 2009-11-03
- Inventor: Chin-Wen Wang , Ching-Chung Wang , Pei-Choa Wang
- Applicant: Chin-Wen Wang , Ching-Chung Wang , Pei-Choa Wang
- Applicant Address: HK Hong Kong
- Assignee: Pyroswift Holding Co., Limited
- Current Assignee: Pyroswift Holding Co., Limited
- Current Assignee Address: HK Hong Kong
- Agent Chun-Ming Shih
- Priority: TW94217518U 20051011
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F28D15/04

Abstract:
A heat-dissipating model includes a heat-conducting member and a heat-dissipating body. The heat-conducting member has a hollow cylinder with a closed end. The interior of the wall of the cylinder is formed with a vacuum chamber. The vacuum chamber is provided with a capillary structure and a working fluid therein. The heat-dissipating body has a through hole for connecting to the outer periphery of the heat-conducting member. Further, the periphery of the heat-dissipating body is provided with a plurality of heat-dissipating fins. With the above arrangement, the heat generated by the heat source can be dissipated to a far place, so that it can be continuously operated at a lower temperature. As a result, the effect of heat conduction or dissipation can be improved and the life is extended.
Public/Granted literature
- US20070079954A1 Heat-Dissipating Model Public/Granted day:2007-04-12
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