Invention Grant
- Patent Title: Printed wiring board and method for manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US11420421Application Date: 2006-05-25
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Publication No.: US07612295B2Publication Date: 2009-11-03
- Inventor: Masaru Takada , Hisashi Minoura , Kiyotaka Tsukada , Hiroyuki Kobayashi , Mitsuhiro Kondo
- Applicant: Masaru Takada , Hisashi Minoura , Kiyotaka Tsukada , Hiroyuki Kobayashi , Mitsuhiro Kondo
- Applicant Address: JP
- Assignee: Ibiden Co., Ltd.
- Current Assignee: Ibiden Co., Ltd.
- Current Assignee Address: JP
- Agency: Saul Ewing LLP
- Agent Theodore Naccarella
- Priority: JP10-041399 19980205
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
In a printed wiring board, an odd number (n) of conductive layers (11-13) and insulating layers (21-23) are alternately laminated upon another. The first conductive layer (11) is constituted as a parts connecting layer and the n-th conductive layer (13) is constituted as an external connecting layer which is connected to external connecting terminals (7). The second to (n−1)-th conductive layers (12) are constituted as current transmitting layers for transmitting internal currents. The surface of the n-th conductive layer (13) is coated with the outermost n-th insulating layer (23) in a state where the external connecting terminals (7) are exposed on the surface. It is preferable to constitute the initial insulating layers of a glass-cloth reinforced prepreg and the external insulating layers of a resin.
Public/Granted literature
- US20060202344A1 Printed Wiring Board and Method for Manufacturing The Same Public/Granted day:2006-09-14
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