Invention Grant
- Patent Title: Thermal vacuum gauge
- Patent Title (中): 热真空计
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Application No.: US11623561Application Date: 2007-01-16
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Publication No.: US07613586B2Publication Date: 2009-11-03
- Inventor: Robert E. Higashi
- Applicant: Robert E. Higashi
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agent Kris T. Fredrick
- Main IPC: G01L7/00
- IPC: G01L7/00

Abstract:
A system for determining a gas pressure or gauging a vacuum in a hermetically sealed enclosure. One or more heater structures and one or more temperature sensor structures situated on a substrate may be used in conjunction for measuring a thermal conductivity of a gas in the enclosure. Each heater has significant thermal isolation from each sensor structure. Electronics connected to each heater and sensor of their respective structures may provide processing to calculate the pressure or vacuum in the enclosure. The enclosure may contain various electronic components such as bolometers.
Public/Granted literature
- US20080168842A1 THERMAL VACUUM GAUGE Public/Granted day:2008-07-17
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