In a method for thermally managing a data center housing at least one electronic component, the heat generated by a heat generating device of the at least one electronic component is estimated. In addition, a temperature detected by a first temperature sensor positioned to detect an interior temperature of the at least one electronic component is received. The estimated heat generated by the at least one heat generating device is substantially masked out from the temperature detected by the first temperature sensor and an inlet temperature of the at least one electronic component is determined from a difference between the substantially masked out temperature and the temperature detected by the first temperature sensor.