发明授权
US07622799B2 Semiconductor device, interposer chip and manufacturing method of semiconductor device
有权
半导体器件，内插芯片及半导体器件的制造方法
- 专利标题： Semiconductor device, interposer chip and manufacturing method of semiconductor device
- 专利标题（中）： 半导体器件，内插芯片及半导体器件的制造方法
-
申请号： US11617239申请日： 2006-12-28
-
公开(公告)号： US07622799B2公开(公告)日： 2009-11-24
- 发明人: Soshi Kuroda , Naoya Yasuda , Hideyuki Arakawa , Akira Yamazaki , Koji Bando
- 申请人： Soshi Kuroda , Naoya Yasuda , Hideyuki Arakawa , Akira Yamazaki , Koji Bando
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Mattingly & Malur, P.C.
- 优先权： JP2006-012760 20060120
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A semiconductor device in which memory chips are stacked on the surface of a wiring substrate has a microcomputer chip and an interposer chip arranged on the surface of the memory chip. The pads of the microcomputer chip and the pads of the interposer chip are arranged almost circularly and are connected by bonding wires.
公开/授权文献
信息查询
IPC分类:
