- 专利标题: Anti-stiction technique for electromechanical systems and electromechanical device employing same
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申请号: US12264774申请日: 2008-11-04
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公开(公告)号: US07625773B2公开(公告)日: 2009-12-01
- 发明人: Markus Lutz , Aaron Partridge , Wilhelm Frey , Markus Ulm , Matthias Metz , Brian Stark , Gary Yama
- 申请人: Markus Lutz , Aaron Partridge , Wilhelm Frey , Markus Ulm , Matthias Metz , Brian Stark , Gary Yama
- 申请人地址: DE Stuttgart
- 专利权人: Robert Bosch GmbH
- 当前专利权人: Robert Bosch GmbH
- 当前专利权人地址: DE Stuttgart
- 代理机构: Kenyon & Kenyon LLP
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/461 ; H01L27/14 ; H01L29/84 ; H01L29/82
摘要:
A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. A second method provides a channel cap having at least one portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, at least in part. The at least one portion is fabricated apart from the electromechanical device and thereafter affixed to the electromechanical device. A third method provides a channel cap having at least one portion disposed over or in at least a portion of the anti-stiction channel to seal an anti-stiction channel, at least in part. The at least one portion may comprise a wire ball, a stud, metal foil or a solder preform. A device includes a substrate, an encapsulation structure and a mechanical structure. An anti-stiction layer is disposed on at least a portion of the mechanical structure. An anti-stiction channel is formed in at least one of the substrate and the encapsulation structure. A cap has at least one preform portion disposed over or in at least a portion of the anti-stiction channel to seal the anti-stiction channel, at least in part.