发明授权
- 专利标题: Multi-metal coplanar waveguide
- 专利标题(中): 多金属共面波导
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申请号: US11690219申请日: 2007-03-23
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公开(公告)号: US07626476B2公开(公告)日: 2009-12-01
- 发明人: Cheon Soo Kim , Myung Shin Kwak , Seong Do Kim , Mun Yang Park , Hyun Kyu Yu , Hee Bum Jung
- 申请人: Cheon Soo Kim , Myung Shin Kwak , Seong Do Kim , Mun Yang Park , Hyun Kyu Yu , Hee Bum Jung
- 申请人地址: KR Daejeon
- 专利权人: Electronics and Telecommunications Research Institute
- 当前专利权人: Electronics and Telecommunications Research Institute
- 当前专利权人地址: KR Daejeon
- 代理机构: Ladas & Parry LLP
- 优先权: KR10-2006-0033587 20060413
- 主分类号: H01P3/08
- IPC分类号: H01P3/08
摘要:
A coplanar waveguide CPW using multi-layer interconnection CMOS technology is provided. In the CPW including an interlayer insulator disposed on a substrate, metal multilayers disposed on the interlayer insulator, and a ground line-a signal line-a ground line formed of an uppermost metal layer, when a ground line of a lowermost layer is connected to the ground line of the uppermost layer, intermediate metal layers are designed to gradually increase or decrease in width, or to be uneven so as to maximize an area where an ultra-high frequency spreads, thereby minimizing CPW loss and maximizing a slow wave effect. As a result, it is possible to improve performance of an ultra-high frequency circuit and miniaturize the circuit.
公开/授权文献
- US20070241844A1 MULTI-METAL COPLANAR WAVEGUIDE 公开/授权日:2007-10-18
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