发明授权
- 专利标题： Adhesion assisting agent-bearing metal foil, printed wiring board, and production method of printed wiring board
- 专利标题（中）： 粘合辅助剂金属箔，印刷线路板和印刷线路板的制造方法
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申请号： US11044533申请日： 2005-01-28
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公开(公告)号： US07629045B2公开(公告)日： 2009-12-08
- 发明人: Kenji Takai , Norio Moriike , Kenichi Kamiyama , Takako Watanabe , Shin Takanezawa , Koji Morita , Katsuyuki Masuda , Kiyoshi Hasegawa
- 申请人： Kenji Takai , Norio Moriike , Kenichi Kamiyama , Takako Watanabe , Shin Takanezawa , Koji Morita , Katsuyuki Masuda , Kiyoshi Hasegawa
- 申请人地址： JP Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2004-024456 20040130; JP2004-116726 20040412
- 主分类号： B32B3/00
- IPC分类号： B32B3/00
摘要：
The invention relates to an adhesion assisting agent-bearing metal foil comprising a layer of an adhesion assisting agent containing an epoxy resin as an indispensable component on a metal, wherein the adhesion assisting agent layer has a thickness of 0.1 to 10 μm. The invention also relates to a printed wiring board being a multilayer wiring board having a plurality of layers, wherein an adhesion assisting agent layer is formed between insulating layers.
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