发明授权
US07629652B2 Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion
有权
具有在输出电极焊盘下方通过的信号布线和靠近周边部分的虚拟布线的半导体器件
- 专利标题： Semiconductor device with signal wirings that pass through under the output electrode pads and dummy wirings near the peripheral portion
- 专利标题（中）： 具有在输出电极焊盘下方通过的信号布线和靠近周边部分的虚拟布线的半导体器件
-
申请号： US11353156申请日： 2006-02-14
-
公开(公告)号： US07629652B2公开(公告)日： 2009-12-08
- 发明人: Shinya Suzuki , Kazuhisa Higuchi
- 申请人： Shinya Suzuki , Kazuhisa Higuchi
- 申请人地址： JP Tokyo
- 专利权人： Renesas Technology Corp.
- 当前专利权人： Renesas Technology Corp.
- 当前专利权人地址： JP Tokyo
- 代理机构： Antonelli, Terry, Stout & Kraus, LLP.
- 优先权： JP2005-037129 20050215
- 主分类号： H01L23/62
- IPC分类号： H01L23/62 ; H01L23/522 ; H01L23/485
摘要：
Signal lines which provide electric connections from an internal circuit formed on a main surface of a semiconductor chip and including, for example, MIS transistor to protective elements constituted by, for example, diodes are drawn out from outlet ports formed on wiring lines disposed between the protective elements, and a signal line region occupied by the signal lines is provided over the protective elements and under electrode pads. A wiring region on the main surface of the semiconductor chip can be enlarged without increasing the chip area.
公开/授权文献
- US20060180864A1 Semiconductor device 公开/授权日：2006-08-17