Invention Grant
- Patent Title: Semiconductor thin film using self-assembled monolayers and methods of production thereof
- Patent Title (中): 使用自组装单层的半导体薄膜及其制造方法
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Application No.: US11417026Application Date: 2006-05-03
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Publication No.: US07633087B2Publication Date: 2009-12-15
- Inventor: Hyeon Jin Shin , Young Su Chung , Hyun Dam Jeong , Sang Heon Hyun , Jong Baek Seon
- Applicant: Hyeon Jin Shin , Young Su Chung , Hyun Dam Jeong , Sang Heon Hyun , Jong Baek Seon
- Applicant Address: KR
- Assignee: Samsung Corning Precision Glass Co., Ltd.
- Current Assignee: Samsung Corning Precision Glass Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2005-0111745 20051122
- Main IPC: H01L35/24
- IPC: H01L35/24 ; H01L51/00
Abstract:
A semiconductor thin film using a self-assembled monolayer (SAM) and a method for producing the semiconductor thin film are provided. According to the semiconductor thin film, a uniform inorganic seed layer is formed by using the self-assembled monolayer so that the adhesion between an insulating layer and a semiconductor layer is enhanced and thus the surface tension is reduced, thereby allowing the semiconductor thin film to have high quality without defects.
Public/Granted literature
- US20070117279A1 Semiconductor thin film using self-assembled monolayers and methods of production thereof Public/Granted day:2007-05-24
Information query
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