发明授权
- 专利标题: Method for manufacturing semiconductor device
- 专利标题(中): 制造半导体器件的方法
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申请号: US11514973申请日: 2006-09-05
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公开(公告)号: US07635883B2公开(公告)日: 2009-12-22
- 发明人: Munehiro Azami , Chiho Kokubo , Aiko Shiga , Atsuo Isobe , Hiroshi Shibata , Shunpei Yamazaki
- 申请人: Munehiro Azami , Chiho Kokubo , Aiko Shiga , Atsuo Isobe , Hiroshi Shibata , Shunpei Yamazaki
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权: JP2001-401281 20011228
- 主分类号: H01L31/062
- IPC分类号: H01L31/062
摘要:
A method for manufacturing a semiconductor device having steps of forming an amorphous semiconductor on a substrate having an insulating surface; patterning the amorphous semiconductor to form plural first island-like semiconductors; irradiating a linearly condensed laser beam on the plural first island-like semiconductors while relatively scanning the substrate, thus crystallizing the plural first island-like semiconductors; patterning the plural first island-like semiconductors that have been crystallized to form plural second island-like semiconductors; forming plural transistors using the plural second island-like semiconductors; and forming a unit circuit using a predetermined number of the transistors, where the second island-like semiconductors used for the predetermined number of the transistors are formed from the first island-like semiconductors that are different from each other.
公开/授权文献
- US20070004104A1 Method for manufacturing semiconductor device 公开/授权日:2007-01-04
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