Invention Grant
- Patent Title: Three-dimensional package and method of making the same
- Patent Title (中): 三维包装及其制作方法
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Application No.: US11928041Application Date: 2007-10-30
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Publication No.: US07635917B2Publication Date: 2009-12-22
- Inventor: Ching-Chun Wang , Yen-Yi Wu , Sem-Wei Lin
- Applicant: Ching-Chun Wang , Yen-Yi Wu , Sem-Wei Lin
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Volentine & Whitt, P.L.L.C.
- Priority: TW95147392A 20061218
- Main IPC: H01L23/34
- IPC: H01L23/34
Abstract:
The present invention relates to a three-dimensional package and method of making the same. The package includes a first substrate, a first chip, a second substrate, a second chip, a spacer, and a first molding compound. The first chip is electrically connected to the first substrate. The second substrate is electrically connected to the first substrate. The second chip is electrically connected to the second substrate. One end of the spacer is attached to the first chip, and the other end of the spacer is attached to the second chip. The first molding compound encapsulates the first substrate, the first chip, the second substrate, the second chip, and the spacer. In the present invention, the adhesion between the spacer and the second chip is enhanced, and the overall thickness of the three-dimensional package is reduced.
Public/Granted literature
- US20080142957A1 THREE-DIMENSIONAL PACKAGE AND METHOD OF MAKING THE SAME Public/Granted day:2008-06-19
Information query
IPC分类:
