发明授权
- 专利标题: Method of manufacturing thin film transistor substrate
- 专利标题(中): 制造薄膜晶体管基板的方法
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申请号: US12009253申请日: 2008-01-16
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公开(公告)号: US07638375B2公开(公告)日: 2009-12-29
- 发明人: Hong-Kee Chin , Yu-Gwang Jeong , Sang-Gab Kim , Joo-Han Kim , Joo-Ae Youn , Min-Seok Oh , Jong-Hyun Choung , Seung-Ha Choi
- 申请人: Hong-Kee Chin , Yu-Gwang Jeong , Sang-Gab Kim , Joo-Han Kim , Joo-Ae Youn , Min-Seok Oh , Jong-Hyun Choung , Seung-Ha Choi
- 申请人地址: KR Gyeonggi-do
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Gyeonggi-do
- 代理机构: Innovation Counsel LLP
- 优先权: KR10-2007-0041378 20070427
- 主分类号: H01L21/84
- IPC分类号: H01L21/84
摘要:
A method of manufacturing a TFT substrate includes: sequentially forming a transparent conductive layer and an opaque conductive layer on a substrate, patterning the transparent conductive layer and the opaque conductive layer by using a first mask to form a gate pattern including a pixel electrode, and forming a gate insulating layer and a semiconductor layer above the substrate. A contact hole is formed which exposes a portion of the pixel electrode and a semiconductor pattern using a second mask. A conductive layer is formed above the substrate and patterned to form a source/drain pattern including a drain electrode which overlaps a portion of the pixel electrode. Portions of the gate insulating layer and the opaque conductive layer above the pixel electrode are removed except a portion overlapping the drain electrode, by using a third mask.
公开/授权文献
- US20080268581A1 Method of manufacturing thin film transistor substrate 公开/授权日:2008-10-30
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