发明授权
US07638888B2 Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
失效
半导体芯片安装基板，半导体芯片安装体，半导体芯片堆叠模块以及半导体芯片安装基板的制造方法
- 专利标题： Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing method
- 专利标题（中）： 半导体芯片安装基板，半导体芯片安装体，半导体芯片堆叠模块以及半导体芯片安装基板的制造方法
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申请号： US12031363申请日： 2008-02-14
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公开(公告)号： US07638888B2公开(公告)日： 2009-12-29
- 发明人: Naoki Suzuki , Akihisa Nakahashi , Yukihiro Maegawa
- 申请人： Naoki Suzuki , Akihisa Nakahashi , Yukihiro Maegawa
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： RatnerPrestia
- 优先权： JP2007-037190 20070216; JP2008-023325 20080201
- 主分类号： H01L23/544
- IPC分类号： H01L23/544
摘要：
There is provided a semiconductor chip mounting substrate including a substrate on which a mounting region for mounting a semiconductor chip and a connection region for interlayer connection of the semiconductor chip are formed, and a plurality of alignment marks for alignment at the time of stacking which are provided around or in the connection region on the substrate, wherein a reinforcing member as a reinforcing region for reinforcing a portion between the plurality of alignment marks is provided on the substrate.
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