发明授权
- 专利标题： Dual substrate loadlock process equipment
- 专利标题（中）： 双基板负载锁定工艺设备
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申请号： US10842079申请日： 2004-05-10
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公开(公告)号： US07641434B2公开(公告)日： 2010-01-05
- 发明人: Shinichi Kurita , Wendell T. Blonigan , Akihiro Hosokawa
- 申请人： Shinichi Kurita , Wendell T. Blonigan , Akihiro Hosokawa
- 申请人地址： US CA Santa Clara
- 专利权人： Applied Materials, Inc.
- 当前专利权人： Applied Materials, Inc.
- 当前专利权人地址： US CA Santa Clara
- 代理机构： Patterson & Sheridan, LLP
- 主分类号： C23C16/00
- IPC分类号： C23C16/00 ; H01L21/00
摘要：
One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.
公开/授权文献
- US20050016454A1 Dual substrate loadlock process equipment 公开/授权日：2005-01-27
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