Invention Grant
- Patent Title: Liquid-cooled inverter assembly
- Patent Title (中): 液冷变频器总成
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Application No.: US11959176Application Date: 2007-12-18
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Publication No.: US07641490B2Publication Date: 2010-01-05
- Inventor: Mark D. Korich , Gregory S. Smith , George John , David Tang , Karl D. Conroy
- Applicant: Mark D. Korich , Gregory S. Smith , George John , David Tang , Karl D. Conroy
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations, Inc.
- Current Assignee: GM Global Technology Operations, Inc.
- Current Assignee Address: US MI Detroit
- Agency: Ingrassia Fisher & Lorenz, PC
- Main IPC: H01R4/64
- IPC: H01R4/64
Abstract:
An inverter assembly includes a housing and a substrate disposed in the housing. The substrate includes at least a first conductive layer patterned to include an alternating current (AC) path and a direct current (DC) path. A plurality of inverter switches is mounted on the substrate and electrically coupled to the AC path and the DC path.
Public/Granted literature
- US20090154101A1 LIQUID-COOLED INVERTER ASSEMBLY Public/Granted day:2009-06-18
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