发明授权
- 专利标题： Clip for heat sink
- 专利标题（中）： 夹子为散热片
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申请号： US11840222申请日： 2007-08-17
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公开(公告)号： US07643299B2公开(公告)日： 2010-01-05
- 发明人: Hsiu-Chang Lai , Hung-Yi Wu , Zhen-Xing Ye , Ke Sun , Xiao-Zhu Chen , Ming-Ke Chen
- 申请人： Hsiu-Chang Lai , Hung-Yi Wu , Zhen-Xing Ye , Ke Sun , Xiao-Zhu Chen , Ming-Ke Chen
- 申请人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen, Guangdong Province TW Tu-Cheng, Taipei Hsien
- 代理商 Frank R. Niranjan
- 优先权： CN200610201052 20061031
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; G06F1/20
摘要：
A clip for mounting a heat sink on a circuit board includes a positioning coil for rotatably engaging with the heat sink. Two elongated arms extend from two ends of a line bisecting the positioning coil respectively, and a pair of hooks formed at distal portions of the two arms respectively for engaging with the circuit board.
公开/授权文献
- US20080101029A1 CLIP FOR HEAT SINK 公开/授权日：2008-05-01
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