Invention Grant
- Patent Title: Manufacturing method for imprinting stamper
- Patent Title (中): 打印压模的制造方法
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Application No.: US11907288Application Date: 2007-10-10
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Publication No.: US07644496B2Publication Date: 2010-01-12
- Inventor: Jeong-Bok Kwak , Seung-Hyun Ra , Choon-Keun Lee , Jae-Choon Cho , Sang-Moon Lee
- Applicant: Jeong-Bok Kwak , Seung-Hyun Ra , Choon-Keun Lee , Jae-Choon Cho , Sang-Moon Lee
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2006-0099449 20061012
- Main IPC: H05K3/02
- IPC: H05K3/02

Abstract:
A manufacturing method for imprinting stamper is disclosed. The manufacturing method includes forming a plurality of concave patterns on an insulation layer, forming a stamper by filling copper in the concave patterns, separating the stamper from the insulation layer, providing roughness on the surface of the stamper, can separate the stamper from the insulation layer, can prevent the deformation of the stamper and can manufacture pluralities of stampers repeatedly.
Public/Granted literature
- US20080086877A1 Manufacturing method for imprinting stamper Public/Granted day:2008-04-17
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