发明授权
- 专利标题: Substrate delivery mechanism
- 专利标题(中): 基材输送机制
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申请号: US11826628申请日: 2007-07-17
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公开(公告)号: US07645185B2公开(公告)日: 2010-01-12
- 发明人: Soichi Isobe , Hideo Aizawa , Hiroomi Torii , Daisuke Koga , Satoshi Wakabayashi
- 申请人: Soichi Isobe , Hideo Aizawa , Hiroomi Torii , Daisuke Koga , Satoshi Wakabayashi
- 申请人地址: JP Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2002/096437 20020329; JP2002/185212 20020625
- 主分类号: B24B7/00
- IPC分类号: B24B7/00
摘要:
A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.
公开/授权文献
- US20070264914A1 Substrate delivery mechanism 公开/授权日:2007-11-15
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