公开(公告)号：US07645185B2

公开(公告)日：2010-01-12

申请号：US11826628

申请日：2007-07-17

申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

IPC分类号： B24B7/00

CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

摘要翻译： 衬底传送机构包括顶环，用于装载衬底的衬底装载器和推动器机构，其中衬底装载器包括顶环引导件，并且推动器机构包括顶环引导升降台，顶环导向器和 顶部环形引导升降台在由基座装载机由推动机构向上移动的状态下由顶环保持的基板下方形成密封空间，其中基板通过在顶部环上排出密封空间而脱离，同时在 同时从设置在顶环的基板保持面的通孔注入流体。

公开(公告)号：US20070093186A1

公开(公告)日：2007-04-26

申请号：US11603194

申请日：2006-11-22

申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

公开(公告)号：US20070264914A1

公开(公告)日：2007-11-15

申请号：US11826628

申请日：2007-07-17

申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

公开(公告)号：US07160180B2

公开(公告)日：2007-01-09

申请号：US11418145

申请日：2006-05-05

申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

IPC分类号： B24B7/22

CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

摘要翻译： 衬底传送机构包括顶环，用于装载衬底的衬底装载器和推动器机构，其中衬底装载器包括顶环引导件，并且推动器机构包括顶环引导升降台，顶环导向器和 顶部环形引导升降台在由基座装载机由推动机构向上移动的状态下由顶环保持的基板下方形成密封空间，其中，基板通过排出密封空间而与顶环分离，同时在 同时从设置在顶环的基板保持面的通孔注入流体。

公开(公告)号：US20060199478A1

公开(公告)日：2006-09-07

申请号：US11418145

申请日：2006-05-05

申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

摘要翻译： 衬底传送机构包括顶环，用于装载衬底的衬底装载器和推动器机构，其中衬底装载器包括顶环引导件，并且推动器机构包括顶环引导升降台，顶环导向器和 顶部环形引导升降台在由基座装载机由推动机构向上移动的状态下由顶环保持的基板下方形成密封空间，其中基板通过在顶部环上排出密封空间而脱离，同时在 同时从设置在顶环的基板保持面的通孔注入流体。

公开(公告)号：US07063598B2

公开(公告)日：2006-06-20

申请号：US10397872

申请日：2003-03-27

申请人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

发明人： Soichi Isobe ,  Hideo Aizawa ,  Hiroomi Torii ,  Daisuke Koga ,  Satoshi Wakabayashi

IPC分类号： B24B7/22

CPC分类号： B24B37/345 ,  H01L21/67051 ,  H01L21/67219 ,  H01L21/67751 ,  H01L21/6838 ,  H01L21/68721 ,  H01L21/68728 ,  H01L21/68742 ,  H01L21/68792

摘要： A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.

公开(公告)号：US07083506B2

公开(公告)日：2006-08-01

申请号：US10895395

申请日：2004-07-21

申请人： Hiroomi Torii ,  Hideo Aizawa ,  Soichi Isobe

发明人： Hiroomi Torii ,  Hideo Aizawa ,  Soichi Isobe

IPC分类号： B24B7/00

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/013 ,  B24B53/12 ,  B24B57/02

摘要： A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

公开(公告)号：US06783445B2

公开(公告)日：2004-08-31

申请号：US09962330

申请日：2001-09-26

申请人： Hiroomi Torii ,  Hideo Aizawa ,  Soichi Isobe

发明人： Hiroomi Torii ,  Hideo Aizawa ,  Soichi Isobe

IPC分类号： B24B5300

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B53/013 ,  B24B53/12 ,  B24B57/02

摘要： A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

公开(公告)号：US06746312B2

公开(公告)日：2004-06-08

申请号：US09864229

申请日：2001-05-25

申请人： Hiroomi Torii ,  Hiroshi Kojima ,  Suguru Ogura ,  Soichi Isobe

发明人： Hiroomi Torii ,  Hiroshi Kojima ,  Suguru Ogura ,  Soichi Isobe

IPC分类号： B24B100

CPC分类号： B24B37/042 ,  B24B49/00

摘要： The present invention relates to a polishing method and apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. A polishing liquid is supplied onto a polishing cloth attached on a turntable, and a semiconductor wafer to be polished is held by a top ring. The turntable and the top ring are rotated, respectively. A surface, to be polished, of the semiconductor wafer held by the top ring is pressed against the polishing cloth on the turntable to polish the semiconductor wafer. When a polished semiconductor wafer held by the top ring is to be removed from the polishing cloth on the turntable, a relative speed of the turntable and the top ring is increased as compared with a relative speed of the turntable and the top ring at a period of polishing.

摘要翻译： 本发明涉及一种将诸如半导体晶片的工件抛光成平面镜面抛光的抛光方法和装置。 抛光液被供给到安装在转盘上的抛光布上，被抛光的半导体晶片由顶环保持。 转盘和顶环分别旋转。 由顶环保持的半导体晶片的待抛光表面被压在转台上的抛光布上以抛光半导体晶片。 当由顶环保持的经抛光的半导体晶片从转台上的研磨布上取出时，转盘和顶环的相对速度与转盘和顶环的相对速度相比在一段时间内增加 的抛光。

公开(公告)号：US20090067959A1

公开(公告)日：2009-03-12

申请号：US11665963

申请日：2007-02-21

申请人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

发明人： Nobuyuki Takahashi ,  Hiroaki Nishida ,  Hiroomi Torii ,  Soichi Isobe ,  Tadakazu Sone ,  Ryuichi Kosuge ,  Hiroyuki Kaneko ,  Hiroshi Sotozaki ,  Takao Mitsukura ,  Takahiro Ogawa ,  Kenichi Sugita

IPC分类号： H01L21/67

CPC分类号： H01L21/67219 ,  B24B37/345 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67751 ,  H01L21/67766 ,  H01L21/68707

摘要： The present invention relates to a substrate processing apparatus which can improve a tact time of substrate processing. A polishing apparatus as the substrate processing apparatus includes plural polishing sections (3a, 3b) each for polishing a semiconductor wafer (W), and a swing transporter (7) for transferring the wafer (W). The swing transporter (7) includes a wafer clamp mechanism (112) adapted to clamp the wafer (W), a vertically moving mechanism (104, 106) for vertically moving the wafer clamp mechanism (112) along a frame (102) of a casing of the polishing section (3a), and a swing mechanism (108, 110) for swinging the wafer clamp mechanism (112) about a shaft adjacent to the frame (102).

摘要翻译： 本发明涉及能够提高基板处理的节拍时间的基板处理装置。 作为基板处理装置的研磨装置包括：用于研磨半导体晶片（W）的多个研磨部（3a，3b）和用于转印晶片（W）的摆动传送装置（7）。 摆动传送器（7）包括适于夹紧晶片（W）的晶片夹紧机构（112），用于沿着晶片夹持机构（102）的框架（102）垂直移动的垂直移动机构（104,106） 抛光部分（3a）的外壳和用于使晶片夹紧机构（112）围绕与框架（102）相邻的轴摆动的摆动机构（108,110）。