Invention Grant
US07645402B2 Dispersant for dispersing nanoparticles in an epoxy resin, method for dispersing nanoparticles using the same, and nanoparticle-containing thin film comprising the same
有权
用于将纳米粒子分散在环氧树脂中的分散剂，使用其分散纳米粒子的方法和包含该纳米粒子的薄膜
- Patent Title: Dispersant for dispersing nanoparticles in an epoxy resin, method for dispersing nanoparticles using the same, and nanoparticle-containing thin film comprising the same
- Patent Title (中): 用于将纳米粒子分散在环氧树脂中的分散剂，使用其分散纳米粒子的方法和包含该纳米粒子的薄膜
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Application No.: US11512967Application Date: 2006-08-30
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Publication No.: US07645402B2Publication Date: 2010-01-12
- Inventor: Seong Jae Choi , Jae Ho Lee , Jae Young Choi , Eun Sung Lee , Don Ik Lee
- Applicant: Seong Jae Choi , Jae Ho Lee , Jae Young Choi , Eun Sung Lee , Don Ik Lee
- Applicant Address: KR
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2005-0109607 20051116
- Main IPC: H01B1/20
- IPC: H01B1/20
Abstract:
Disclosed herein are a dispersant for dispersing nanoparticles that are surface-bound with capping ligands in a polymer matrix having an epoxide group, a method for dispersing the nanoparticles using the dispersant, and a nanoparticle-containing thin film including the dispersant.
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