Invention Grant
US07645686B2 Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit
有权
将应变基板上的芯片接合的方法和在半导体读取电路下进行应变的方法
- Patent Title: Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit
- Patent Title (中): 将应变基板上的芯片接合的方法和在半导体读取电路下进行应变的方法
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Application No.: US12212302Application Date: 2008-09-17
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Publication No.: US07645686B2Publication Date: 2010-01-12
- Inventor: Manuel Fendler , Abdenacer Ait-Mani , Alain Gueugnot , Francois Marion
- Applicant: Manuel Fendler , Abdenacer Ait-Mani , Alain Gueugnot , Francois Marion
- Applicant Address: FR Paris
- Assignee: Commissariat a l'Energie Atomique
- Current Assignee: Commissariat a l'Energie Atomique
- Current Assignee Address: FR Paris
- Agency: Pearne & Gordon LLP
- Priority: FR0757676 20070919
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
The invention concerns a method of collective bonding of individual chips on a strained substrate (44), which comprises the following steps: functionalised layers (40) are arranged on a support (41), in an adjacent non-contiguous manner, with a space e between two neighboring layers (40), a calibrated drop of adhesive (43) is deposited on each of these functionalised layers, the strained substrate (44) is transferred onto these drops of adhesive, the parts of the assembly thereby formed are singularized to produce chips (45) bonded to the surface of strained substrate. The invention also concerns a method of placing under strain a semiconductor reading circuit by a substrate in a material of different coefficient of expansion.
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