发明授权
- 专利标题： Stack package implementing conductive support
- 专利标题（中）： 堆栈包实现导电支持
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申请号： US11328289申请日： 2006-01-10
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公开(公告)号： US07649248B2公开(公告)日： 2010-01-19
- 发明人: Hyung-Gil Baek
- 申请人： Hyung-Gil Baek
- 申请人地址： KR Gyeonggi-do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2005-0072484 20050808
- 主分类号： H01L23/02
- IPC分类号： H01L23/02
摘要：
A stack package may have a plurality of unit packages. Each unit package may include a first substrate, a semiconductor chip, and a second substrate. Conductive supports may stack the second substrate on the first substrate. Conductive bumps may be provided on the bottom surface of the first substrate. An encapsulant may seal the semiconductor chip exposing the top surface of the second substrate. The conductive bumps of an upper unit package may be connected to the second substrate of the lower unit package.
公开/授权文献
- US20070029660A1 Stack package implementing conductive support 公开/授权日：2007-02-08
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