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    SEMICONDUCTOR MODULES WITH ENHANCED JOINT RELIABILITY
    2.
    发明申请
    SEMICONDUCTOR MODULES WITH ENHANCED JOINT RELIABILITY 审中-公开
    具有增强联接可靠性的半导体模块

    公开(公告)号：US20080169547A1

    公开(公告)日：2008-07-17

    申请号：US11971846

    申请日：2008-01-09

    申请人： Hyung-Gil BAEK

    发明人： Hyung-Gil BAEK

    IPC分类号： H01L23/538

    CPC分类号： H05K1/0271 ,  H01L2224/16 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/181 ,  H05K3/4626 ,  H05K2201/0133 ,  H05K2201/068 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2224/0401

    摘要： Provided is a semiconductor module with enhanced joint reliability. The semiconductor module includes a package, a printed circuit board (PCB), and conductive joint structures for electrically connecting the package with the PCB. The PCB includes at least one buffer layer that can alleviate the thermal deformation of the semiconductor module due to a difference in the coefficient of thermal expansion between the PCB and the conductive joint structures.

    摘要翻译： 提供了具有增强的接头可靠性的半导体模块。 半导体模块包括封装，印刷电路板（PCB）和用于将封装与PCB电连接的导电接合结构。 PCB包括至少一个缓冲层，其可以减轻由于PCB和导电接头结构之间的热膨胀系数的差异导致的半导体模块的热变形。

    SEMICONDUCTOR MEMORY MODULE HAVING AN OBLIQUE MEMORY CHIP
    6.
    发明申请
    SEMICONDUCTOR MEMORY MODULE HAVING AN OBLIQUE MEMORY CHIP 失效
    具有OBLIQUE MEMORY CHIP的半导体存储器模块

    公开(公告)号：US20070252271A1

    公开(公告)日：2007-11-01

    申请号：US11740821

    申请日：2007-04-26

    申请人： Joong-Hyun BAEK ,  Sun-Won KANG ,  Moon-Jung KIM ,  Hyung-Gil BAEK ,  Hee-Jin LEE

    发明人： Joong-Hyun BAEK ,  Sun-Won KANG ,  Moon-Jung KIM ,  Hyung-Gil BAEK ,  Hee-Jin LEE

    IPC分类号： H01L23/34

    CPC分类号： H01L25/16 ,  G11C5/04 ,  H01L21/563 ,  H01L25/0655 ,  H01L2224/73203 ,  H05K1/181 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10159 ,  Y02P70/611

    摘要： Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.

    摘要翻译： 提供了一种半导体存储器模块，其允许形成在模块基板和安装在模块基板上的存储芯片之间的填充构件完全填充模块基板和存储器芯片之间的空间。 根据本发明的实施例，半导体存储器模块包括具有安装在基板上的至少一个存储芯片的模块基板，使得其边缘对于将模块基板平分的主轴和短轴倾斜。 倾斜方向允许在基板上形成的存储芯片之间的开口改善，使得填充构件可以适当地形成在模块基板和存储芯片之间，以防止填充构件未形成的空隙。

    Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package
    7.
    发明申请
    Semiconductor package, method of manufacturing the same, stacked semiconductor package including the same and method of manufacturing the stacked semiconductor package 审中-公开
    半导体封装，其制造方法，包括该半导体封装的堆叠半导体封装以及制造堆叠半导体封装的方法

    公开(公告)号：US20070069396A1

    公开(公告)日：2007-03-29

    申请号：US11525903

    申请日：2006-09-25

    申请人： Hyung-Gil Baek ,  Sang-Wook Park ,  Joong-Hyun Baek

    发明人： Hyung-Gil Baek ,  Sang-Wook Park ,  Joong-Hyun Baek

    IPC分类号： H01L29/40 ,  H01L21/00

    CPC分类号： H01L23/49833 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： Example embodiments relate to a semiconductor package, a method of manufacturing the semiconductor package, a stacked semiconductor package including the semiconductor package, and a method of manufacturing the stacked semiconductor package. Other example embodiments relate to a semiconductor package having a structure that allows at least two packages to be stacked, a method of manufacturing the semiconductor package, a stacked semiconductor package including the semiconductor package, and a method of manufacturing the stacked semiconductor package. A semiconductor package may include a first circuit substrate having signal patterns that may be formed on an outer face of the first circuit substrate, a second circuit substrate facing an inner face of the first circuit substrate, a semiconductor chip inserted between the first and second circuit substrates and electrically connected to the signal patterns, and a connection member for electrically connecting the first circuit substrate to the second circuit substrate. N (where N is an integer ≧2) semiconductor packages may be stacked to form a stacked semiconductor package.

    摘要翻译： 示例性实施例涉及半导体封装，制造半导体封装的方法，包括半导体封装的层叠半导体封装以及制造堆叠半导体封装的方法。 其他示例实施例涉及具有允许堆叠至少两个封装的结构的半导体封装，制造半导体封装的方法，包括半导体封装的堆叠半导体封装以及制造堆叠半导体封装的方法。 半导体封装可以包括具有可形成在第一电路基板的外表面上的信号图案的第一电路基板，面对第一电路基板的内表面的第二电路基板，插入在第一和第二电路之间的半导体芯片 基板并电连接到信号图案，以及连接构件，用于将第一电路基板电连接到第二电路基板。 N（其中N是整数> = 2）可以堆叠半导体封装以形成堆叠的半导体封装。

    Semiconductor memory module having an oblique memory chip
    8.
    发明授权
    Semiconductor memory module having an oblique memory chip 失效
    具有倾斜存储芯片的半导体存储模块

    公开(公告)号：US07812445B2

    公开(公告)日：2010-10-12

    申请号：US11740821

    申请日：2007-04-26

    申请人： Joong-Hyun Baek ,  Sun-Won Kang ,  Moon-Jung Kim ,  Hyung-Gil Baek ,  Hee-Jin Lee

    发明人： Joong-Hyun Baek ,  Sun-Won Kang ,  Moon-Jung Kim ,  Hyung-Gil Baek ,  Hee-Jin Lee

    IPC分类号： H01L23/34

    CPC分类号： H01L25/16 ,  G11C5/04 ,  H01L21/563 ,  H01L25/0655 ,  H01L2224/73203 ,  H05K1/181 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10159 ,  Y02P70/611

    摘要： Provided is a semiconductor memory module allowing a filling member formed between a module substrate and memory chips mounted on the module substrate to completely fill the space between the module substrate and the memory chips. According to embodiments of the present invention, the semiconductor memory module includes a module substrate having at least one memory chip mounted on the substrate such that its edges are oblique to major and minor axes bisecting the module substrate. The oblique orientation allows for an improved opening between memory chips formed on the substrate so that the filling member may be properly formed between the module substrate and the memory chips to prevent voids where the filling member is not formed.

    摘要翻译： 提供了一种半导体存储器模块，其允许形成在模块基板和安装在模块基板上的存储芯片之间的填充构件完全填充模块基板和存储器芯片之间的空间。 根据本发明的实施例，半导体存储器模块包括具有安装在基板上的至少一个存储芯片的模块基板，使得其边缘对于将模块基板平分的主轴和短轴倾斜。 倾斜方向允许在基板上形成的存储芯片之间的开口改善，使得填充构件可以适当地形成在模块基板和存储芯片之间，以防止填充构件未形成的空隙。