Invention Grant
US07649745B2 Circuit board including stubless signal paths and method of making same
失效
电路板包括无铅信号路径及其制作方法
- Patent Title: Circuit board including stubless signal paths and method of making same
- Patent Title (中): 电路板包括无铅信号路径及其制作方法
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Application No.: US11557709Application Date: 2006-11-08
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Publication No.: US07649745B2Publication Date: 2010-01-19
- Inventor: Pascal Meier , Sanjay Dabral
- Applicant: Pascal Meier , Sanjay Dabral
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Grossman, Tucker, Perreault & Pfleger, PLLC
- Main IPC: H05K7/00
- IPC: H05K7/00

Abstract:
A circuit board may include first and second sides, a plurality of circuit board layers between the sides, and a plurality of signal traces located in respective circuit board layers. The circuit board layers and the signal traces may extend from a first component connection region at the first side of the circuit board to a second component connection region at the first side of the circuit board. The signal traces may thus form stubless signal paths through the circuit board between the component connection regions. Of course, many alternatives, variations, and modifications are possible without departing from this embodiment.
Public/Granted literature
- US20080123273A1 Circuit Board Including Stubless Signal Paths and Method of Making Same Public/Granted day:2008-05-29
Information query