Invention Grant
US07651382B2 Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
有权
具有冗余接触点的电气互连器件，用于减少电容性短截线和改善的信号完整性
- Patent Title: Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
- Patent Title (中): 具有冗余接触点的电气互连器件，用于减少电容性短截线和改善的信号完整性
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Application No.: US12127195Application Date: 2008-05-27
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Publication No.: US07651382B2Publication Date: 2010-01-26
- Inventor: Gary Yasumura , Joseph C. Fjelstad , Kevin P. Grundy , William F. Wiedemann , Matthew J. Stepovich
- Applicant: Gary Yasumura , Joseph C. Fjelstad , Kevin P. Grundy , William F. Wiedemann , Matthew J. Stepovich
- Applicant Address: US CA Cupertino
- Assignee: Interconnect Portfolio LLC
- Current Assignee: Interconnect Portfolio LLC
- Current Assignee Address: US CA Cupertino
- Agent Ronald R. Shea, Esq.
- Main IPC: H01R4/48
- IPC: H01R4/48
Abstract:
An electrical interconnection device for establishing redundant contacts between the ends of two conductive elements to be mated, creating a electrical interconnection without capacitive stubs.
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