Invention Grant
- Patent Title: Solid-state imaging device and method for manufacturing the same
- Patent Title (中): 固态成像装置及其制造方法
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Application No.: US10807348Application Date: 2004-03-24
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Publication No.: US07651881B2Publication Date: 2010-01-26
- Inventor: Kosuke Takasaki , Kazuhiro Nishida , Kiyofumi Yamamoto
- Applicant: Kosuke Takasaki , Kazuhiro Nishida , Kiyofumi Yamamoto
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2003-083446 20030325; JP2003-320271 20030911
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A transfer film, on which an adhesive is applied, is glued to plural spacers formed on a glass substrate. The glass substrate is laid on a working table, and one end of the transfer film is fixed to a winding roller. A peeling guide is set at a position over the transfer film. The winding roller is driven to wind the transfer film while the working table moves horizontally. While winding the transfer film, the angle between the glass substrate and the transfer film is kept constant. After the transfer film is peeled off, the adhesive is uniformly transferred to each of the spacers.
Public/Granted literature
- US20040189855A1 Solid-state imaging device and method for manufacturing the same Public/Granted day:2004-09-30
Information query
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