Invention Grant
- Patent Title: Interconnect system without through-holes
- Patent Title (中): 互连系统无通孔
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Application No.: US11055578Application Date: 2005-02-09
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Publication No.: US07652381B2Publication Date: 2010-01-26
- Inventor: Kevin P. Grundy , Joseph C. Fjelstad , Gary Yasumura , William F. Wiedemann , Para K. Segaram
- Applicant: Kevin P. Grundy , Joseph C. Fjelstad , Gary Yasumura , William F. Wiedemann , Para K. Segaram
- Applicant Address: US CA Cupertino
- Assignee: Interconnect Portfolio LLC
- Current Assignee: Interconnect Portfolio LLC
- Current Assignee Address: US CA Cupertino
- Agent Ronald R. Shea, Esq.
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
Structures employed by a plurality of packages, printed circuit boards, connectors and interposers to create signal paths which reduce the deleterious signal quality issues associated with the use of through-holes. Disclosed structures can coexist with through-hole implementations.
Public/Granted literature
- US20050189640A1 Interconnect system without through-holes Public/Granted day:2005-09-01
Information query
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