-
公开(公告)号:US20110065332A1
公开(公告)日:2011-03-17
申请号:US12953171
申请日:2010-11-23
CPC分类号: H01R12/714 , H01R12/52 , H01R12/7082 , H01R13/24 , H01R13/6599
摘要: An electrical connector. An electrical connector comprising a connector body having a first channel and a first conductive element extending through the first channel in a first tip section. The first tip section having a first moment arm that, when forced in contact with a first conductive surface, twists the first conductive element to produce a torsion force. The torsion force holds the first tip section in contact with the first conductive surface.
-
公开(公告)号:US20090119464A1
公开(公告)日:2009-05-07
申请号:US11933445
申请日:2007-11-01
申请人: Kevin P. Grundy , Para K. Segaram
发明人: Kevin P. Grundy , Para K. Segaram
IPC分类号: G06F12/00
CPC分类号: G06F13/1689 , G06F12/06 , G06F13/4256 , G06F2212/1016
摘要: A memory system having a plurality of memory devices and a memory controller. The memory devices are coupled to one another in a chain. The memory controller is coupled to the chain and configured to output a memory access command that is received by each of the memory devices in the chain and that selects a set of two or more of the memory devices to be accessed.
摘要翻译: 一种具有多个存储器件和存储器控制器的存储器系统。 存储器件在链条中彼此耦合。 存储器控制器耦合到链路并且被配置为输出由链中的每个存储器件接收的存储器访问命令,并且选择要访问的两个或更多个存储器件的一组。
-
公开(公告)号:US20090027137A1
公开(公告)日:2009-01-29
申请号:US12128620
申请日:2008-05-29
IPC分类号: H03H7/38
CPC分类号: H05K1/0243 , G01R31/2822 , H01L23/13 , H01L23/49822 , H01L23/49838 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2223/6627 , H01L2223/6633 , H01L2224/48091 , H01L2224/4824 , H01L2224/48465 , H01L2224/49175 , H01L2924/00014 , H01L2924/14 , H01L2924/15173 , H01L2924/1903 , H01L2924/19039 , H01L2924/3011 , H01L2924/3025 , H01P3/08 , H01P5/028 , H05K1/024 , H05K2201/0191 , H05K2201/09154 , H05K2201/09727 , Y10S438/981 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: Disclosed are tapered dielectric and conductor structures which provide controlled impedance interconnection while signal conductor lines transition from finer pitches to coarser pitches thereby obviating electrical discontinuities generally associated with changes of circuit contact pitch. Also disclosed are methods for the construction of the devices and applications therefore.
摘要翻译: 公开了锥形电介质和导体结构,其提供受控的阻抗互连,同时信号导体线从更细的间距转换到较粗的间距,从而消除通常与电路接触间距的变化相关的电中断。 还公开了用于构造装置和应用的方法。
-
4.
公开(公告)号:US20080273647A1
公开(公告)日:2008-11-06
申请号:US12174128
申请日:2008-07-16
申请人: PARA K. SEGARAM
发明人: PARA K. SEGARAM
IPC分类号: H04L7/00
CPC分类号: H04L25/028 , H04L7/0008 , H04L7/0025 , H04L7/0337 , H04L25/0272 , H04L25/0292 , H04L25/14
摘要: In a communications device having a physical layer device and a processing device connected to the physical layer device, the number of input/output (I/O) ports required for communication between the devices in the gigabit range is substantially reduced by utilizing millivolt differential I/O drivers and receivers. In addition, a calibration feedback loop synchronizes the data and clock signals on the processing device, thereby eliminating the need to recover the clock on the processing device.
摘要翻译: 在具有连接到物理层设备的物理层设备和处理设备的通信设备中,在千兆比特范围内的设备之间进行通信所需的输入/输出(I / O)端口的数量通过利用毫伏差分I / O驱动程序和接收器。 此外,校准反馈环路在处理设备上同步数据和时钟信号,从而消除了在处理设备上恢复时钟的需要。
-
公开(公告)号:US07111108B2
公开(公告)日:2006-09-19
申请号:US10823499
申请日:2004-04-12
申请人: Kevin P. Grundy , Para K. Segaram
发明人: Kevin P. Grundy , Para K. Segaram
IPC分类号: G06F12/00
CPC分类号: G06F13/1684 , G06F13/4022
摘要: A memory system having a memory controller, interface device and plurality of memory elements. The interface device is coupled to the memory controller via a first high-speed signal path. The plurality of memory elements are removably coupled to the interface device via respective second signal paths, each of the second signal paths having a lower signaling bandwidth than the first signaling path.
摘要翻译: 一种具有存储器控制器,接口装置和多个存储器元件的存储器系统。 接口设备通过第一高速信号路径耦合到存储器控制器。 多个存储器元件经由相应的第二信号路径可移除地耦合到接口设备,每个第二信号路径具有比第一信令路径更低的信令带宽。
-
公开(公告)号:US06185226B2
公开(公告)日:2001-02-06
申请号:US09103258
申请日:1998-06-22
申请人: Para K. Segaram , Roy T. Myers, Jr.
发明人: Para K. Segaram , Roy T. Myers, Jr.
IPC分类号: H04J308
摘要: A repeater interface controller (“RIC”) integrated circuit with integrated filters and buffer drivers is provided for use in a repeater. In one embodiment, the RIC uses two filters to filter link pulse signals and data signals for a plurality of ports. Thus, the RIC is able to concurrently provide filtered link pulses to some ports and filtered data signals to other ports. Further, because only two filters are used, the area required to implement the plurality of ports is reduced relative to conventional repeaters that use a filter for each port. In another embodiment of the present invention, a RIC includes a logic circuit and a plurality of analog multiplexers and twisted pair buffer drivers. The analog multiplexers receive signals on their input lines and select which of these signals are passed to the buffer drivers to be outputted. The logic circuit provides control signals to the analog multiplexers such that the analog multiplexers select a new input line when the signal on the new input line is approximately the same as the signal on the currently selected input line. As a result, the signal passed on to the buffer drivers remains approximately the same, thereby reducing switching noise.
摘要翻译: 具有集成滤波器和缓冲驱动器的中继器接口控制器(“RIC”)集成电路可用于中继器。 在一个实施例中,RIC使用两个滤波器来滤波多个端口的链路脉冲信号和数据信号。 因此,RIC能够同时向某些端口提供滤波的链路脉冲,并将滤波的数据信号同时提供给其他端口。 此外,由于仅使用两个滤波器,相对于使用每个端口的滤波器的常规中继器,实现多个端口所需的面积减小。 在本发明的另一实施例中,RIC包括逻辑电路和多个模拟多路复用器和双绞线缓冲器驱动器。 模拟多路复用器在其输入线路上接收信号,并选择这些信号中的哪一个传送到缓冲器驱动器以输出。 逻辑电路向模拟多路复用器提供控制信号,使得当新输入线上的信号与当前选择的输入线上的信号大致相同时,模拟多路复用器选择新的输入线。 结果,传递到缓冲器驱动器的信号保持大致相同,从而降低开关噪声。
-
公开(公告)号:US08598696B2
公开(公告)日:2013-12-03
申请号:US13044194
申请日:2011-03-09
IPC分类号: H01L23/52
CPC分类号: H01L24/85 , H01L21/56 , H01L23/3107 , H01L23/49517 , H01L23/49537 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/32225 , H01L2224/32245
摘要: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
摘要翻译: 具有多个表面的IC封装,用于与互连元件互连,从IC芯片连接到位于其多于一个表面上的封装组件的I / O端子,并且与空间上分离的其它器件或组件互连。
-
公开(公告)号:US08324727B2
公开(公告)日:2012-12-04
申请号:US12720110
申请日:2010-03-09
申请人: Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , William F. Wiedemann , Thomas J. Obenhuber , Inessa Obenhuber, legal representative
发明人: Joseph C. Fjelstad , Kevin P. Grundy , Para K. Segaram , William F. Wiedemann , Thomas J. Obenhuber
IPC分类号: H01L23/34
CPC分类号: H01C7/003 , H01C13/02 , H01G4/33 , H01L23/49816 , H01L23/49822 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48235 , H01L2224/49109 , H01L2924/00014 , H01L2924/01078 , H01L2924/07802 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/19041 , H01L2924/30107 , H05K1/0231 , H05K1/0233 , H05K1/0234 , H05K1/0246 , H05K1/186 , H05K3/4602 , H05K2201/09536 , H05K2201/10643 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.
摘要翻译: 公开了适用于在电子互连衬底内,互连衬底和电子部件之间或IC封装内的垂直互连模式下放置和使用的薄型离散电子部件结构。
-
公开(公告)号:US20110215475A1
公开(公告)日:2011-09-08
申请号:US13044194
申请日:2011-03-09
申请人: Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Inessa Obenhuber , Kevin P. Grundy
发明人: Joseph C. Fjelstad , Para K. Segaram , Thomas J. Obenhuber , Inessa Obenhuber , Kevin P. Grundy
IPC分类号: H01L23/532
CPC分类号: H01L24/85 , H01L21/56 , H01L23/3107 , H01L23/49517 , H01L23/49537 , H01L23/49805 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/49171 , H01L2224/73265 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/32225 , H01L2224/32245
摘要: An IC package having multiple surfaces for interconnection with interconnection elements making connections from the IC chip to the I/O terminations of the package assembly which reside on more than one of its surfaces and which make interconnections to other devices or assemblies that are spatially separated.
摘要翻译: 具有多个表面的IC封装,用于与互连元件互连,从IC芯片连接到位于其多于一个表面上的封装组件的I / O端子,并且与空间上分离的其它器件或组件互连。
-
公开(公告)号:US07989929B2
公开(公告)日:2011-08-02
申请号:US11930217
申请日:2007-10-31
IPC分类号: H01L23/48
CPC分类号: H05K1/147 , H01L23/49805 , H01L24/16 , H01L24/48 , H01L2224/05599 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/48463 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/0228 , H05K1/0237 , H05K3/222 , H05K2201/10356 , H05K2201/10378 , H05K2201/1053 , H05K2201/10734 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A direct-connect signaling system including a printed circuit board and first and second integrated circuit packages disposed on the printed circuit board. A plurality of electric signal conductors extend between the first and second integrated circuit packages suspended above the printed circuit board.
摘要翻译: 一种直接连接信号系统,包括印刷电路板和布置在印刷电路板上的第一和第二集成电路封装。 多个电信号导体在悬挂在印刷电路板上的第一和第二集成电路封装之间延伸。
-
-
-
-
-
-
-
-
-