发明授权
- 专利标题: Method for fabricating a plurality of electromagnetic radiation emitting semiconductor chips
- 专利标题(中): 制造多个电磁辐射半导体芯片的方法
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申请号: US12290097申请日: 2008-10-27
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公开(公告)号: US07655488B2公开(公告)日: 2010-02-02
- 发明人: Stefan Bader , Dominik Eisert , Berthold Hahn , Stephan Kaiser
- 申请人: Stefan Bader , Dominik Eisert , Berthold Hahn , Stephan Kaiser
- 申请人地址: DE Munich
- 专利权人: Osram GmbH
- 当前专利权人: Osram GmbH
- 当前专利权人地址: DE Munich
- 代理机构: Cohen Pontani Lieberman & Pavane LLP
- 优先权: DE10245628 20020930
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
Method for fabricating a semiconductor chip which emits electromagnetic radiation, wherein to improve the light yield of semiconductor chips which emit electromagnetic radiation, a textured reflection surface is integrated on the p-side of a semiconductor chip. The semiconductor chip has an epitaxially produced semiconductor layer stack based on GaN, which comprises an n-conducting semiconductor layer, a p-conducting semiconductor layer and an electromagnetic radiation generating region which is arranged between these two semiconductor layers. The surface of the p-conducting semiconductor layer which faces away from the radiation-generating region is provided with three-dimensional pyramid-like structures. A mirror layer is arranged over the whole of this textured surface. A textured reflection surface is formed between the mirror layer and the p-conducting semiconductor layer.
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