发明授权
- 专利标题: Package for an electronic component and method for its production
- 专利标题(中): 电子元件封装及其生产方法
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申请号: US11444530申请日: 2006-06-01
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公开(公告)号: US07656018B2公开(公告)日: 2010-02-02
- 发明人: Michael Bauer , Jens Pohl
- 申请人: Michael Bauer , Jens Pohl
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 代理机构: Edell, Shapiro & Finnan, LLC
- 优先权: DE102005025543 20050601
- 主分类号: H01L23/24
- IPC分类号: H01L23/24
摘要:
A package for an electronic component includes a synthetic package compound. This synthetic package compound includes an upper outer contact on its upper side and a lower outer contact on its lower side, where the upper outer contact is electrically connected to the lower outer contact via a conduction path. The synthetic package compound includes a mixture of a plastic with filler particles. The conduction path is formed from free conducting metallic inclusions. The filler particles are provided with metallorganic compounds or inorganic complex compounds. The inclusions are formed by photolytic decomposition of the metallorganic compounds or inorganic complex compounds.