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发明授权
US07656040B2 Stack structure of circuit board with semiconductor component embedded therein 有权
具有嵌入其中的半导体元件的电路板的堆叠结构

Stack structure of circuit board with semiconductor component embedded therein
摘要：
A stack structure of circuit boards embedded with semiconductor components therein is proposed, which includes at least two semiconductor components embedded circuit boards, a plurality of conductive bumps, and at least one adhesive layer. The circuit boards are each formed with a circuit layer having a plurality of electrical connection pads. The conductive bumps are formed on the electrical connection pads of at least one of the circuit boards. The adhesive layer is formed between the circuit boards such that a portion of the adhesive layer between the conductive bumps and the electrical connection pads, or between the opposing conductive bumps, forms a conductive channel and thereby forms an electrical connection between the circuit boards.
摘要（中）：

提出了嵌入其中的半导体部件的电路板的堆叠结构，其包括至少两个半导体部件嵌入式电路板，多个导电凸块和至少一个粘合剂层。 电路板各自形成有具有多个电连接焊盘的电路层。 导电凸块形成在至少一个电路板的电连接焊盘上。 粘合剂层形成在电路板之间，使得导电凸块和电连接焊盘之间或相对的导电凸块之间的粘合剂层的一部分形成导电通道，从而在电路板之间形成电连接。

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