A system and method for generating a thin sample, the method includes: milling an intermediate section of a thin sample such as to enable an upper portion of the thin sample to tilt in relation to a lower portion of the thin sample; wherein the lower portion is connected to a wafer from which the thin sample was formed. A system and method for inspecting a thin sample, the method includes: A method for inspecting a thin sample, the method comprising: illuminating, by a charged particle beam, a tilted upper portion of a thin sample that is connected, via a milled intermediate section, to a lower portion of the thin sample; wherein the lower portion is connected to a wafer from which the thin sample was formed; and collecting particles and photons resulting from the illumination.