发明授权
- 专利标题: Manufacturing process of leadframe-based BGA packages
- 专利标题(中): 基于引线框架的BGA封装的制造工艺
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申请号: US12153451申请日: 2008-05-19
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公开(公告)号: US07662672B2公开(公告)日: 2010-02-16
- 发明人: Hung-Tsun Lin
- 申请人: Hung-Tsun Lin
- 申请人地址: BM Hamilton HM TW Hsinchu
- 专利权人: ChipMos Technologies (Bermuda) Ltd.,ChipMos Technologies Inc.
- 当前专利权人: ChipMos Technologies (Bermuda) Ltd.,ChipMos Technologies Inc.
- 当前专利权人地址: BM Hamilton HM TW Hsinchu
- 代理机构: WPAT, P.C.
- 代理商 Anthony King; Kay Yang
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A manufacturing process of a leadframe-based BGA package is disclosed. A leadless leadframe with an upper layer and a lower layer is provided for the package. The upper layer includes a plurality of ball pads, and the lower layer includes a plurality of sacrificial pads aligning and connecting with the ball pads. A plurality of leads are formed in either the upper layer or the lower layer to interconnect the ball pads or the sacrificial pads. An encapsulant is formed to embed the ball pads after chip attachment and electrical connections. During manufacturing process, a half-etching process is performed after encapsulation to remove the sacrificial pads to make the ball pads electrically isolated and exposed from the encapsulant for solder ball placement where the soldering areas of the ball pads are defined without the need of solder mask(s) to solve the problem of solder bleeding of the solder balls on the leads or the undesired spots during reflow. Moreover, mold flash can easily be detected and removed.
公开/授权文献
- US20090087953A1 Manufacturing process of leadframe-based BGA packages 公开/授权日:2009-04-02