Invention Grant
- Patent Title: Phenolic resin with low level of free bisphenol
- Patent Title (中): 酚醛树脂具有低水平的游离双酚
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Application No.: US11594866Application Date: 2006-11-09
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Publication No.: US07662902B2Publication Date: 2010-02-16
- Inventor: Kuen Yuan Hwang , An Pang Tu , Chun Hsiung Kao , Fang Shian Su
- Applicant: Kuen Yuan Hwang , An Pang Tu , Chun Hsiung Kao , Fang Shian Su
- Applicant Address: TW Taipei
- Assignee: Chang Chun Plastics Co., Ltd.
- Current Assignee: Chang Chun Plastics Co., Ltd.
- Current Assignee Address: TW Taipei
- Agency: Birch, Stewart, Kolasch & Birch, LLP.
- Priority: CN95122260A 20060621
- Main IPC: C08G8/20
- IPC: C08G8/20 ; C08L63/00 ; C08L63/02
Abstract:
A phenolic resin having not more than 5 wt% of free bisphenol and a molecular weight distribution Mw/Mn of not more than 2.0 is prepared by reacting a bisphenol and aldehyde in the presence of an alkaline catalyst at a temperature of from 0° C. to 100° C., neutralizing with an acid, adding an acid to adjust the pH to from 0 to 6, heating to a temperature of from 50° C. to 200° C, and vacuuming to recover the phenolic resin.
Public/Granted literature
- US20070299163A1 Novel phenolic resin, its preparation and use thereof Public/Granted day:2007-12-27
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