Invention Grant
- Patent Title: Semiconductor device module structure
- Patent Title (中): 半导体器件模块结构
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Application No.: US10597136Application Date: 2004-11-30
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Publication No.: US07663220B2Publication Date: 2010-02-16
- Inventor: Kenji Kitamura , Shinichi Yataka , Takao Endo , Yuujiro Tominaga , Toshihide Tanaka , Koichiro Sato
- Applicant: Kenji Kitamura , Shinichi Yataka , Takao Endo , Yuujiro Tominaga , Toshihide Tanaka , Koichiro Sato
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2004-008022 20040115
- International Application: PCT/JP2004/018102 WO 20041130
- International Announcement: WO2005/069381 WO 20050728
- Main IPC: H01L23/52
- IPC: H01L23/52 ; H01L23/34
Abstract:
A semiconductor module includes: a semiconductor element (13) having a working unit (11) and a guard ring unit (12); and heat radiation members (15, 14) arranged on an upper surface and a lower surface of the semiconductor element for cooling the semiconductor element. A passivation film (20) covers the guard ring but does not cover the working unit. The upper heat radiation member (15) is made of a flat metal plate connected to the working unit without contact with the passivation film. The upper heat radiation member is connected to the lower heat radiation member (14) in the thermo-conducting way.
Public/Granted literature
- US20070138596A1 Semiconductor device module structure Public/Granted day:2007-06-21
Information query
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