Invention Grant
- Patent Title: Butted contact structure
- Patent Title (中): 对接接触结构
-
Application No.: US11320512Application Date: 2005-12-27
-
Publication No.: US07663237B2Publication Date: 2010-02-16
- Inventor: Yuan-Ching Peng , Chloe Hsin-yi Chen , David Hsu-Wei Lwu , Shyue-Shyh Lin , Wei-Ming Chen
- Applicant: Yuan-Ching Peng , Chloe Hsin-yi Chen , David Hsu-Wei Lwu , Shyue-Shyh Lin , Wei-Ming Chen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/48
- IPC: H01L23/48

Abstract:
A semiconductor structure and a method of forming the same using replacement gate processes are provided. The semiconductor structure includes a butted contact coupling a source/drain region, or a silicide on the source/drain region, of a first transistor and a gate extension. The semiconductor structure further includes a contact pad over the source/drain region of the first transistor and electrically coupled to the source/drain region. The addition of the contact pad reduces the contact resistance and the possibility that an open circuit is formed between the butted contact and the source/drain region. The contact pad preferably has a top surface substantially leveled with a top surface of the gate extension.
Public/Granted literature
- US20070145519A1 Butted contact structure Public/Granted day:2007-06-28
Information query
IPC分类: