发明授权
- 专利标题： Feedthrough array for use in implantable medical devices
- 专利标题（中）： 用于可植入医疗器械的馈通阵列
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申请号： US11278232申请日： 2006-03-31
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公开(公告)号： US07668597B2公开(公告)日： 2010-02-23
- 发明人: David B. Engmark , Andrew J. Ries
- 申请人： David B. Engmark , Andrew J. Ries
- 申请人地址： US MN Minneapolis
- 专利权人： Medtronic, Inc.
- 当前专利权人： Medtronic, Inc.
- 当前专利权人地址： US MN Minneapolis
- 主分类号： A61N1/00
- IPC分类号： A61N1/00
摘要：
A feedthrough array for use in an implantable medical device is provided including an insulator, a plurality of conductive feedthrough pins extending through the insulator, and a ferrule including a flange extending inwardly from a ferrule sidewall along at least a majority of a length of a first ferrule side. A capacitor is disposed over the insulator and conductively coupled to the ferrule flange.
公开/授权文献
- US20070239223A1 FEEDTHROUGH ARRAY FOR USE IN IMPLANTABLE MEDICAL DEVICES 公开/授权日：2007-10-11
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