Invention Grant
- Patent Title: Chain extension for thermal materials
- Patent Title (中): 热延伸材料的延伸
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Application No.: US11326954Application Date: 2006-01-06
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Publication No.: US07671120B2Publication Date: 2010-03-02
- Inventor: James C. Matayabas, Jr.
- Applicant: James C. Matayabas, Jr.
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- Main IPC: C08K5/24
- IPC: C08K5/24
Abstract:
A curable material useful as thermal material comprises at least one vinyl-terminated silicone oil, at least one conductive filler, and at least one hydrogen terminated silicone oil. The hydrogen terminated silicone oil is used to reduce a shear modulus G′ of the cured thermal interface material.
Public/Granted literature
- US20060122304A1 Chain extension for thermal materials Public/Granted day:2006-06-08
Information query
