发明授权
US07673972B2 Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters
失效
微流体喷射装置，用于制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头
- 专利标题： Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection head having high resistance thin film heaters
- 专利标题（中）： 微流体喷射装置，用于制造微流体喷射头的方法和具有高电阻薄膜加热器的微流体喷射头
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申请号： US11683572申请日： 2007-03-08
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公开(公告)号： US07673972B2公开(公告)日： 2010-03-09
- 发明人: Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
- 申请人： Yimin Guan , Stuart Jacobsen , Carl Edmond Sullivan
- 申请人地址： US KY Lexington
- 专利权人： Lexmark International, Inc.
- 当前专利权人： Lexmark International, Inc.
- 当前专利权人地址： US KY Lexington
- 主分类号： B41J2/05
- IPC分类号： B41J2/05
摘要：
Micro-fluid ejection devices, methods for making micro-fluid ejection heads, and micro-fluid ejection heads, including a micro-fluid ejection head. One such micro-fluid ejection head has relatively high resistance thin film heaters adjacent to a substrate. The thin film material comprises silicon, metal, and carbon (SiMC wherein M is a metal). Each thin film heater has a sheet resistance ranging from about 100 to about 600 ohms per square and a thickness ranging from about 100 to about 800 Angstroms.
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