发明授权
US07677901B1 Electric connecting apparatus for semiconductor devices and contact used therefor
有权
用于半导体器件的电连接装置和用于其的接触
- 专利标题: Electric connecting apparatus for semiconductor devices and contact used therefor
- 专利标题(中): 用于半导体器件的电连接装置和用于其的接触
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申请号: US12433055申请日: 2009-04-30
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公开(公告)号: US07677901B1公开(公告)日: 2010-03-16
- 发明人: Katsumi Suzuki , Takeyuki Suzuki
- 申请人: Katsumi Suzuki , Takeyuki Suzuki
- 申请人地址: JP Tokyo
- 专利权人: Yamaichi Electronics Co., Ltd.
- 当前专利权人: Yamaichi Electronics Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Finnegan, Henderson, Farabow, Garrett & Dunner, LLP
- 优先权: JP2008-333948 20081226
- 主分类号: H01R12/00
- IPC分类号: H01R12/00
摘要:
The contact includes the plunger and a coil spring unit for holding the plunger thereon. The plunger includes an upper contact strip having a plurality of contact points on an upper end portion thereof, a wide portion, and a lower contact strip having two contact strips each having a contact point at a lower end portion thereof. The coil spring unit includes a spring portion and a funnel shaped tight wound portion including a guiding portion and a slimly wound portion having a contact point at a lower end portion thereof. The plurality of contact points provided on the upper contact strip is arranged in a plane so as to be broadened at a distance. The contact points provided on the two contact strips of the lower contact strip are formed to be resiliently deformable with respect to each other.
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