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64 条记录 (耗时 0.037 秒)

    Socket for a semiconductor device
    1.
    发明授权
    Socket for a semiconductor device 有权
    半导体器件插座

    公开(公告)号：US08535101B2

    公开(公告)日：2013-09-17

    申请号：US13227035

    申请日：2011-09-07

    申请人： Katsumi Suzuki ,  Takeyuki Suzuki

    发明人： Katsumi Suzuki ,  Takeyuki Suzuki

    IPC分类号： H01R24/00

    CPC分类号： H01R13/24 ,  G01R1/045 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/06722 ,  G01R1/07314 ,  H01L2224/16225 ,  H01R12/73 ,  H01R13/6474 ,  H01R2201/20

    摘要： A device, wherein, at cells 10ai of a metallic upper housing 10 corresponding to a signal line, between an end portion of an adapter 24 that has electrically insulating properties the inner surface of an upper housing 12 that has electrically insulating properties, an annular air layer Ai is formed at the peripheries of sleeves 20S of contact terminals 20ai that have the same structure as each other, and wherein, at the cells 10ai that correspond to ground lines, contact points 20CT2 of the contact terminals 20ai are inserted in through-holes 12ai of the lower housing 12, and their contact points 20CT1 are inserted into small diameter holes 22b of conductive collars 22 that touch the inner surfaces of the cells 10ai.

    摘要翻译： 一种装置，其中在对应于信号线的金属上壳体10的电池单元10ai处，具有电绝缘性能的适配器24的端部之间具有电绝缘性能的上壳体12的内表面，环形空气 在彼此具有相同结构的接触端子20ai的套筒20S的周边形成有层A 1，并且在与接地线对应的电池单元10ai处，接触端子20ai的接触点20CT2插入通孔 下部壳体12的12a和它们的接触点20CT1插入到接触电池单元10ai的内表面的导电套环22的小直径孔22b中。

    ELECTRIC CONNECTING APPARATUS
    3.
    发明申请
    ELECTRIC CONNECTING APPARATUS 有权
    电气连接装置

    公开(公告)号：US20110058338A1

    公开(公告)日：2011-03-10

    申请号：US12862364

    申请日：2010-08-24

    申请人： Eiji KOBORI ,  Takeyuki Suzuki

    发明人： Eiji KOBORI ,  Takeyuki Suzuki

    IPC分类号： H05K7/20 ,  H01R13/00

    CPC分类号： G01R1/0458

    摘要： Provided is an electric connecting apparatus configured to dissipate heat generated from a contact itself via an insulating plate, a metallic enclosure, and a printed wiring board. The electric connecting apparatus includes at least a housing configured to accommodate multiple contacts. At least part of the housing is made of a material having high heat conductivity. The multiple contacts are arranged linearly in at least one row. The multiple contacts are in abutting contact with the at least part of the housing via at least an insulating member made of an electrically insulative material having high heat conductivity.

    摘要翻译： 提供了一种电连接装置，其被配置为经由绝缘板，金属外壳和印刷线路板消散从接触件本身产生的热量。 电连接装置至少包括构造成容纳多个触点的壳体。 壳体的至少一部分由具有高导热性的材料制成。 多个触点在至少一行中线性排列。 多个触点经由至少一个由具有高导热性的电绝缘材料制成的绝缘构件与壳体的至少一部分抵接接触。

    Emergency notification apparatus for vehicle
    5.
    发明授权
    Emergency notification apparatus for vehicle 失效
    车辆紧急通知装置

    公开(公告)号：US07432804B2

    公开(公告)日：2008-10-07

    申请号：US11510353

    申请日：2006-08-25

    申请人： Takeyuki Suzuki ,  Masayuki Sato

    发明人： Takeyuki Suzuki ,  Masayuki Sato

    IPC分类号： G08B1/08

    CPC分类号： H04W4/90 ,  H04W76/50

    摘要： An emergency notification apparatus for a vehicle includes: a receiver provided in a subject vehicle, being adapted to receive emergency information from another vehicle; a transmitter provided in the subject vehicle, being adapted to transmit the emergency information received by the receiver to a predetermined emergency information center via a base station for wireless communication; a navigation device which navigates the subject vehicle to a predetermined destination; and a controller which controls the navigation device so as to set a communicable area of the base station as the destination when the receiver receives the emergency information outside of the communicable area and controls the transmitter so as to transmit the emergency information via the base station after the subject vehicle reaches the communicable area guided by the navigation device.

    摘要翻译： 一种用于车辆的紧急通知装置包括：设置在本车辆中的接收器，适于从另一车辆接收紧急信息; 设置在所述主体车辆中的发射机，适于经由用于无线通信的基站将所述接收机接收到的紧急信息发送到预定的紧急信息中心; 将本车辆导航到预定目的地的导航装置; 以及控制器，其控制所述导航装置，以便当所述接收机在所述可通信区域之外接收到所述紧急信息时，将所述基站的可通信区域设置为所述目的地，并且控制所述发射机，以便经由所述基站经由所述基站发送所述紧急信息 本车辆到达由导航装置引导的通信区域。

    Chlorinated vinyl chloride resin composition
    6.
    发明授权
    Chlorinated vinyl chloride resin composition 有权
    氯化氯乙烯树脂组合物

    公开(公告)号：US07332544B2

    公开(公告)日：2008-02-19

    申请号：US10553733

    申请日：2004-04-19

    申请人： Takeyuki Suzuki

    发明人： Takeyuki Suzuki

    IPC分类号： C08L47/00 ,  C08L23/28

    CPC分类号： C08L27/24 ,  C08L23/286 ,  C08L51/04 ,  C08L2666/02

    摘要： A chlorinated vinyl chloride-based resin composition in which from 2 to 9 parts by weight of an MBS resin and from 0.5 to 3 parts by weight of chlorinated polyethylene are blended to 100 parts by weight of a chlorinated vinyl chloride-based resin with a chlorine content of from 62 to 70% by weight obtained by post-chlorinating a vinyl chloride-based resin, which can provide an injection molding product such as a joint of excellent heat resistance, impact strength, moldability and surface property.

    摘要翻译： 将含有2〜9重量份MBS树脂和0.5〜3重量份氯化聚乙烯的氯化氯乙烯系树脂组合物与氯化氯乙烯系树脂100重量份混合， 通过后氯化氯乙烯类树脂获得的含量为62〜70重量％，其可以提供耐热性，冲击强度，成型性和表面性质优异的接头等注射成型制品。

    Method for assembling testing equipment for semiconductor substrate
    8.
    发明申请
    Method for assembling testing equipment for semiconductor substrate 失效
    组装半导体衬底检测设备的方法

    公开(公告)号：US20060240581A1

    公开(公告)日：2006-10-26

    申请号：US11407267

    申请日：2006-04-20

    申请人： Takeyuki Suzuki ,  Ryo Ujike

    发明人： Takeyuki Suzuki ,  Ryo Ujike

    IPC分类号： H01L21/66 ,  G01R31/26

    CPC分类号： G01R31/31905 ,  G01R31/2886 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

    摘要： Upon an assembly of a probe head unit, the relative positions of the probe pins 28ai to those of the electrode group 24E in the pitch-changing substrate 24 are determined by making the positions of the through-holes 26A, 26B, 26C and 26D in the contact block 26 to coincide with the positioning marks 24MA, 24MB, 24MC and 24MD in the pitch-changing substrate 24.

    摘要翻译： 在探针头单元的组装时，通过使通孔26A，26B的位置确定探针28a的位置与俯仰改变基底24中的电极组24E的相对位置， 26C和26D与变桨基板24中的定位标记24 MA，24 MB，24 MC和24 MD重合。

    Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card
    10.
    发明申请
    Semiconductor device connector, semiconductor device carrier, semiconductor device socket using the same and probe card 失效
    半导体器件连接器，半导体器件载体，使用其的半导体器件插座和探针卡

    公开(公告)号：US20060138641A1

    公开(公告)日：2006-06-29

    申请号：US11315482

    申请日：2005-12-23

    申请人： Takeyuki Suzuki

    发明人： Takeyuki Suzuki

    IPC分类号： H01L23/12

    CPC分类号： H01R13/2464 ,  G01R1/0466 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor device carrier comprising; a carrier housing having a housing portion for accommodating a semiconductor device; an electrode sheet disposed in the carrier housing, having a front surface wiring conductively arranged on a front surface of an insulation substrate, a rear surface wiring conductively arranged on a rear surface of the insulation substrate, a rear surface bump contact placement wiring, and a bump contact disposed in a contact placement portion and an elastic sheet disposed in the carrier housing to be in contact with the bottom of the electrode sheet; wherein a width of the rear surface bump contact placement wiring in correspondence to a bump contact to be in contact with an extreme electrode section of the semiconductor device is smaller than a width of the front surface bump contact placement wiring on which a bump contact to be in contact with the extreme electrode section is arranged.

    摘要翻译： 一种半导体器件载体，包括： 载体壳体，具有用于容纳半导体器件的壳体部分; 布置在所述载体壳体中的电极板，具有导电地布置在绝缘基板的前表面上的前表面布线，导电地布置在所述绝缘基板的后表面上的后表面布线，后表面凸块接触布置布线和 布置在接触放置部分中的凸起接触件和布置在载体壳体中以与电极片的底部接触的弹性片; 其特征在于，与所述半导体装置的前端电极部接触的与所述凸点接触对应的所述背面突起接触放置配线的宽度小于所述前面凸块接触配线的宽度， 与极极部分接触。