Invention Grant
US07678423B2 System and method for depositing thin layers on non-planar substrates by stamping
有权
通过冲压在非平面基板上沉积薄层的系统和方法
- Patent Title: System and method for depositing thin layers on non-planar substrates by stamping
- Patent Title (中): 通过冲压在非平面基板上沉积薄层的系统和方法
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Application No.: US11711115Application Date: 2007-02-27
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Publication No.: US07678423B2Publication Date: 2010-03-16
- Inventor: Stephen Forrest , Xin Xu , Xiangfei Qi , Marcelo Davanco
- Applicant: Stephen Forrest , Xin Xu , Xiangfei Qi , Marcelo Davanco
- Applicant Address: US MI Ann Arbor US NJ Princeton
- Assignee: The Regents of the University of Michigan,The Trustees of Princeton University
- Current Assignee: The Regents of the University of Michigan,The Trustees of Princeton University
- Current Assignee Address: US MI Ann Arbor US NJ Princeton
- Agency: Townsend and Townsend and Crew LLP
- Main IPC: B05D3/00
- IPC: B05D3/00 ; B28B11/04 ; B05C1/00
Abstract:
An elastomeric stamp is used to deposit material on a non-planar substrate. A vacuum mold is used to deform the elastomeric stamp and pressure is applied to transfer material from the stamp to the substrate. By decreasing the vacuum applied by the vacuum mold, the elasticity of the stamp may be used to apply this pressure. Pressure also may be applied by applying a force to the substrate and/or the stamp. The use of an elastomeric stamp allows for patterned layers to be deposited on a non-planar substrate with reduced chance of damage to the patterned layer.
Public/Granted literature
- US20080202673A1 System and method for depositing thin layers on non-planar substrates by stamping Public/Granted day:2008-08-28
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