发明授权
- 专利标题： Method for fabricating a module including a sintered joint
- 专利标题（中）： 用于制造包括烧结接头的模块的方法
-
申请号： US12128224申请日： 2008-05-28
-
公开(公告)号： US07682875B2公开(公告)日： 2010-03-23
- 发明人: Karsten Guth , Ivan Nikitin
- 申请人： Karsten Guth , Ivan Nikitin
- 申请人地址： DE Neubiberg
- 专利权人： Infineon Technologies AG
- 当前专利权人： Infineon Technologies AG
- 当前专利权人地址： DE Neubiberg
- 代理机构： Dicke, Billig & Czaja, PLLC
- 主分类号： H01L21/603
- IPC分类号： H01L21/603
摘要：
A method comprises applying a paste comprising metal grains, a solvent, and a sintering inhibitor to one of a die and a metal layer. The method comprises evaporating the solvent in the paste and placing the one of the die and the metal layer on the other of the die and the metal layer such that the paste contacts the die and the metal layer. The method comprises applying a force to the one of the die and the metal layer and decomposing the sintering inhibitors to form a sintered joint joining the die to the metal layer.
公开/授权文献
- US20090294963A1 MODULE INCLUDING A SINTERED JOINT 公开/授权日：2009-12-03
信息查询
IPC分类:
