Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US11658638Application Date: 2005-07-26
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Publication No.: US07683492B2Publication Date: 2010-03-23
- Inventor: Kenji Yoshida
- Applicant: Kenji Yoshida
- Applicant Address: JP Yokohama-shi
- Assignee: System Fabrication Technologies, Inc.,Liquid Design Systems, Inc.
- Current Assignee: System Fabrication Technologies, Inc.,Liquid Design Systems, Inc.
- Current Assignee Address: JP Yokohama-shi
- Agency: Marshall Gerstein & Borun LLP
- Priority: JP2004-217735 20040726
- International Application: PCT/JP2005/013645 WO 20050726
- International Announcement: WO2006/011477 WO 20060202
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L25/04

Abstract:
The present invention provides a semiconductor device which can realize the mounting of a plurality of chips at a high-speed, with high packaging density and at a low cost. In mounting a memory device chip 103 and an ASIC 104 on a wiring chip 102, connection pads 110, 116 are respectively formed along one opposing sides of the memory device chip 103 and the ASIC 104 on the wiring chip 102, the arrangement positions of the respective connection pads 110, 116 define the shortest distance assumes the shortest distance therebetween and, at the same time wiring lines which are formed on the wiring chip 102 are also shortened. Accordingly, it is possible to mount the memory device chip 103 and the ASIC 104 on the wiring chip 102 with high packaging density and, at the same time, since the wiring distance can be shortened, the high speed operation can be realized.
Public/Granted literature
- US20090224241A1 Semiconductor device Public/Granted day:2009-09-10
Information query
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